Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible.

We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges.

Qorvo serves diverse high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense.

Visit www.qorvo.com to learn how our diverse and innovative team is helping connect, protect and power our planet.

Summary:

The primary focus of the successful candidate will be to help Qorvo improve and expand its current packaging technology offerings in support of the State-of-the-Art (SOTA) Heterogeneous Integrated Packaging (SHIP) RF production and prototyping center.

The SHIP program was established to ensure that microelectronics packaging expertise and leadership is available for both U.S. defense contractors and commercial clients that require domestic design, validation, assembly, test and manufacturing of next-generation RF components.

Responsibilities:

• Develop package assembly processes for new product introduction (NPI)

• Directly interface with equipment for programming and assembly of small volume prototypes

• Support launch and ramp of products into production environment including documentation of work instructions and training

• Review process metrics including yield, processing/cycle time, utilization, and SPC data

• Document technical issues, perform root cause analysis, generate reports, and present information to cross functional teams

Qualifications:

• BS or higher in Chemical, Mechanical or Electrical engineering.

• Entry level position.

• Position requires working directly with equipment in a clean room environment

• Ideal candidate will have strong troubleshooting and communication skills with an affinity for electro-mechanical equipment and/or knowledge of process material properties

• Familiarity with statistical analysis, process control, and database query tools is a plus (Spotfire, Labview, Oracle, Python, et al.)

• Common package assembly processes and equipment include:

  • Automated Optical Inspection, die attach, wire bonding, surface mount, transfer and compression mold, singulation/saw, laser marking, and wafer level handling and processing techniques

This position is not eligible for visa sponsorship by the Company.

MAKE A DIFFERENCE AT QORVO

We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets - we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.

We are an Equal Employment Opportunity (EEO) / Affirmative Action employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, military or veteran status, physical or mental disability, genetic information, and/or any other status protected by law.